Accession Number : AD0163523
Title : Method of Making Printed Circuit Assemblies.
Descriptive Note : Patent,
Corporate Author : OFFICE OF THE SECRETARY OF THE ARMY WASHINGTON D C
Personal Author(s) : Geisler,Robert R.
Report Date : 12 JAN 1971
Pagination or Media Count : 3
Abstract : The patent is concerned with a method of making double-sided or multilayer printed circuit boards with hole-free terminal leads on one surface of the board for attachment of wire leads while providing electrical interconnection between conductive layers.
Descriptors : (*PRINTED CIRCUITS, *PATENTS), CIRCUIT INTERCONNECTIONS, MANUFACTURING, ELECTROPLATING, FOILS(MATERIALS), SANDWICH CONSTRUCTION
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE