Accession Number : AD0163523

Title :   Method of Making Printed Circuit Assemblies.

Descriptive Note : Patent,

Corporate Author : OFFICE OF THE SECRETARY OF THE ARMY WASHINGTON D C

Personal Author(s) : Geisler,Robert R.

Report Date : 12 JAN 1971

Pagination or Media Count : 3

Abstract : The patent is concerned with a method of making double-sided or multilayer printed circuit boards with hole-free terminal leads on one surface of the board for attachment of wire leads while providing electrical interconnection between conductive layers.

Descriptors :   (*PRINTED CIRCUITS, *PATENTS), CIRCUIT INTERCONNECTIONS, MANUFACTURING, ELECTROPLATING, FOILS(MATERIALS), SANDWICH CONSTRUCTION

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE