Accession Number : AD0163858
Title : Bonding Process for Polyphenylene Oxidedielectric Microwave Circuits and Bonded Assembly.
Descriptive Note : Patent,
Corporate Author : OFFICE OF THE SECRETARY OF THE ARMY WASHINGTON D C
Personal Author(s) : Satterfield,Homer E. ; Stottlemyer,Keith D. ; Brown,David L. ; Roberts,Leslie
Report Date : 24 OCT 1972
Pagination or Media Count : 5
Abstract : The patent describes microwave striplines formed by intimately bonding circuit planes to polyphenylene oxide shield planes, heat and pressure is used in combination with an interface bonding material comprised of a polymeric resin composed of a random copolymer product of copolymerization of ethylene and acrylic acid.
Descriptors : (*STRIP TRANSMISSION LINES, *PATENTS), BONDING, PLASTICS, DIELECTRICS, COPPER, MICROWAVE EQUIPMENT
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE