Accession Number : AD0164126

Title :   Process for Bonding Chip Devices to Hybrid Circuitry.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON D C

Personal Author(s) : Leinkram,Charles Z.

Report Date : 01 AUG 1972

Pagination or Media Count : 5

Abstract : The patent describes a process for bonding chip devices to hybrid circuitry including the steps of: (1) prewetting the chips by scrubbing in a gold-silicon solder lake at 400C, (2) heating the substrate to eutectic temperature of 377C, (3) positioning the chips on the gold land of the substrate, (4) pushing the chips onto the substrate to overcome the surface tension and cause the solder to flow, completely wetting the chip and substrate.

Descriptors :   (*Bonding, *Patents), Microminiaturization(Electronics), Semiconductor devices, Integrated circuits, Gold, Silicon, Eutectics, Substrates

Subject Categories : Electrical and Electronic Equipment
      Fabrication Metallurgy

Distribution Statement : APPROVED FOR PUBLIC RELEASE