Accession Number : AD0164167
Title : Method of Making a Circuit Assembly.
Descriptive Note : Patent,
Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON D C
Personal Author(s) : Lindberg,Frank A.
Report Date : 20 JUN 1972
Pagination or Media Count : 5
Abstract : The patent describes a method to beam leads of a plurality of integrated circuit chips to a metallization layer on a transparent compliant film. The chips are first registered in matching etched holes on a flat ground steel block. The flat beam leads lie on the surface of the block and support the chips. The film is arranged on top of the etched block with its metallization pattern in alignment with the corresponding beam leads. At room temperature the film is pressed downwardly on top of the exposed beam leads by an opposing flat ground block. Heat is then applied for bonding, and pressure is maintained until the assembly cools to prevent misregistration.
Descriptors : (*Circuit interconnections, *Patents), (*Integrated circuits, Bonding), Metal films, Assembly
Subject Categories : Electrical and Electronic Equipment
Mfg & Industrial Eng & Control of Product Sys
Distribution Statement : APPROVED FOR PUBLIC RELEASE