Accession Number : AD0164222

Title :   Crossover for Large Scale Arrays.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON D C

Personal Author(s) : Hicks,Robert E.

Report Date : 26 OCT 1971

Pagination or Media Count : 9

Abstract : The patent relates to a method for providing crossovers in microelectronic circuitry. More particularly, the subject invention contemplates the fabrication of crossovers by deposition of insulative material on a conductor at the point of crossover and subsequent deposition of a crossing conductor over the insulative bridge. Additional advantages other than the elimination of point-to-point wiring methods include improved circuit reliability; room temperature circuit assembly; decreased manufacturing time; increased unit density; flip-chip utilization; and reduction of stray capacitance.

Descriptors :   *Circuit interconnections, *Patents, Integrated circuits, Arrays, Microcircuits, Layers, Metals, Substrates, Deposition, Masking

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE