Accession Number : AD0164257

Title :   Microelectronic Interconnection Substrate.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON D C

Personal Author(s) : Leinkram,Charles Z. ; Prom,Richard L.

Report Date : 21 SEP 1971

Pagination or Media Count : 5

Abstract : The patent discloses an interconnection substrate for use in hybrid microelectronic systems interconnecting transistors, resistive elements, semiconductor-integrated circuits, and other microelectronic circuit elements. The substrate consists of an insulative base and three metal films, for example, a first chromium film, a second gold film metallurgically bonded to the chromium film, and a third nickel film bonded to the gold.

Descriptors :   *Microcircuits, *Circuit interconnections, *Patents, Substrates, Metal films, Chromium, Gold, Nickel

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE