Accession Number : AD0164257
Title : Microelectronic Interconnection Substrate.
Descriptive Note : Patent,
Corporate Author : DEPARTMENT OF THE NAVY WASHINGTON D C
Personal Author(s) : Leinkram,Charles Z. ; Prom,Richard L.
Report Date : 21 SEP 1971
Pagination or Media Count : 5
Abstract : The patent discloses an interconnection substrate for use in hybrid microelectronic systems interconnecting transistors, resistive elements, semiconductor-integrated circuits, and other microelectronic circuit elements. The substrate consists of an insulative base and three metal films, for example, a first chromium film, a second gold film metallurgically bonded to the chromium film, and a third nickel film bonded to the gold.
Descriptors : *Microcircuits, *Circuit interconnections, *Patents, Substrates, Metal films, Chromium, Gold, Nickel
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE