Accession Number : AD0164428

Title :   Method for Packaging Hybrid Circuits.

Descriptive Note : Patent,

Corporate Author : DEPARTMENT OF THE AIR FORCE WASHINGTON D C

Personal Author(s) : Lane,Clyde H.

Report Date : 26 JUN 1973

Pagination or Media Count : 3

Abstract : The patent describes a method which will provide an efficient, low cost method of hermetically sealing hybrid circuits or component chips in a hybrid circuit. The method uses a metal O-ring and a plastic, glass, solder, or alloy preform.

Descriptors :   *Hybrid circuits, *Patents, *Packaging, O rings, Adhesives

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE