Accession Number : AD0164709

Title :   Method of Making a Photosensitive Solder Maskant.

Descriptive Note : Patent Application,

Corporate Author : DEPARTMENT OF THE AIR FORCE WASHINGTON D C

Personal Author(s) : Harmon,E. F.

Report Date : 21 DEC 1973

Pagination or Media Count : 9

Abstract : The patent application describes a method for forming a photosensitive maskant on the surface of a printed circuit board for the purpose of preventing solder splatter during the assembly of electrical components to the printed circuitry. In the method of the invention, a photosensitive resin is applied to the surface of a circuit board in such a manner that predetermined areas of the resin are selectively exposed to ultraviolet radiation in order to effect a cure of that predetermined portion. The uncured area of the resin is then developed away to bare certain areas of the board for use in the solder connection of electrical component elements to the circuitry of the board.

Descriptors :   *Photomasking, Patents, Masks, Photosensitivity, Printed circuits, Polymers, Phthalates, Soldering

Subject Categories : Electrical and Electronic Equipment
      Mfg & Industrial Eng & Control of Product Sys

Distribution Statement : APPROVED FOR PUBLIC RELEASE