Accession Number : AD0258395

Title :   DEVELOPMENT OF ULTRA HIGH TEMPERATURE DIELECTRIC MATERIALS FOR EMBEDDING AND ENCAPSULATING ELECTRONIC COMPONENTS

Corporate Author : SYNTHETIC MICA CO WEST CALDWELL N J

Personal Author(s) : BARR,F.A. ; MCCARTHY,J.P.

Report Date : 16 NOV 1960

Pagination or Media Count : 1

Abstract : INCREASING THE CONCENTRATION OF AQUEOUS ALUMINUM PHOSPHATE DECREASED THE POROSITY OF PHOSPHATEBONDED SYNTHETIC MICA COMPOUND. Porosity can be decreased by glass coatings but the thermal expansion of the glass must match that of the sample. A volume shrinkage of approximately 7% was calculated for a standard phosphate-bonded synthetic mica compound. Initial results of electrical properties at elevated temperatures indicate that the phosphate-bonded synthetic mica systems are suitable for 500 C use. Commercial electronic components (magnetic amplifiers, capacitors, and small motors) were successfully potted and encapsulated with the bonded synthetic mica compound. (Author)

Descriptors :   *EMBEDDING SUBSTANCES, *ENCAPSULATION, *MICA, ALUMINUM COMPOUNDS, BINDERS, COATINGS, DIELECTRICS, ELECTRICAL PROPERTIES, ELECTRONIC EQUIPMENT, GLASS, HIGH TEMPERATURE, MATERIALS, PHOSPHATES, PHYSICAL PROPERTIES, POROSITY

Distribution Statement : APPROVED FOR PUBLIC RELEASE