Accession Number : AD0265499

Title :   DEVELOPMENT OF ULTRA HIGH TEMPERATURE DIELECTRIC MATERIALS FOR EMBEDDING AND ENCAPSULATING ELECTRONIC COMPONENTS

Corporate Author : SYNTHETIC MICA CO WEST CALDWELL N J

Personal Author(s) : BARR,F.A. ; MCCARTHY,J.P.

Report Date : 16 MAY 1961

Pagination or Media Count : 1

Abstract : Phosphate synthetic mica was investigated as a dielectric material for encapsulating and embedding electronic components for 500 C use. Physical properties of the system were determined and found to be suitable for high temperature use. Various methods of reducing porosity were investigated including dry pressing, glass coating, additives and various phosphate bonds. The use of a devitrified glass sealing cement as a coating for the phosphate synthetic mica resulted in a composite material cured below 500 C, having good physical properties with water absorption less than 1%. Commerical capacitors, transformers, and motors were encapsulated and tested. Prototype high temperature resistors were constructed and encapsulated for 500 C applications using ceramo-plastic injection molding techniques in combination with the phosphate-mica dielectric material. (Author)

Descriptors :   *DIELECTRICS, *ELECTRONIC EQUIPMENT, *EMBEDDING SUBSTANCES, *ENCAPSULATION, *MICA, ADHESIVES, ALUMINATES, ALUMINUM COMPOUNDS, BINDERS, BORON COMPOUNDS, COATINGS, DIELECTRIC PROPERTIES, GLASS, GYPSUM, HIGH TEMPERATURE, MEASUREMENT, MECHANICAL PROPERTIES, PARTICLES, PHOSPHATES, PHYSICAL PROPERTIES, POROSITY, THERMAL EXPANSION, THERMODYNAMICS

Distribution Statement : APPROVED FOR PUBLIC RELEASE