Accession Number : AD0284989

Title :   ULTRA HIGH TEMPERATURE DIELECTRIC EMBEDDING MATERIALS

Corporate Author : SYNTHETIC MICA CO WEST CALDWELL N J

Personal Author(s) : RODNEY,STANLEY

Report Date : 27 JUL 1962

Pagination or Media Count : 1

Abstract : A glass was developed w ich has the same devitrification properties and better resistance to reduction than the comm rcially vailable type used previously. The optimum devitrification temperature of the glass was found to be between 550 C and 600 C. Fluidized bed operation was found to be most efficient u ing gl ss p rticles in he size range between 75 microns at the upper limit a 45 microns at the lower limit. The fluidized bed technique lead to a coating thickness which is uniform to !10%. (Author)

Descriptors :   *CERAMIC COATINGS, *EMBEDDING SUBSTANCES, *ENCAPSULATION, *GLASS SEALS, DIELECTRICS, ELECTRIC INSULATION, ELECTRONIC EQUIPMENT, GLASS, HIGH TEMPERATURE, MANUFACTURING, MICA, PHOSPHATES

Distribution Statement : APPROVED FOR PUBLIC RELEASE