Accession Number : AD0285041

Title :   PLANAR INTEGRATION OF THIN FILM FUNCTIONAL CIRCUIT UNITS

Corporate Author : IBM COMMAND CONTROL CENTER FEDERAL SYSTEMS DIV KINGSTON N Y

Personal Author(s) : CARROLL,W.N. ; JENNY,F.F.

Report Date : 31 MAY 1962

Pagination or Media Count : 1

Abstract : Four process and material changes to the solder attachment technique are discussed, along with data obtained during environmental tests. A description is given of the improvements made to the basic vacuum evaporation process including improved source designs, and methods of evaporating various forms of cilicon monoxide. A discussion of substrate surface requirements is presented along with new specifications for procuring substrates. Details relating to the fabrication techniques for jumpers and interconnections are presented. The selected packaging format for the functional assemblies is described along with the results of mechanical tests conducted. A description of tests designed to determine the electrical noise susceptibility of the functional assemblies is presented, along with the data obtained. Data on the spread and tolerance of the film resistors contained on 27 functional assemblies are presented. (Author)

Descriptors :   *CIRCUITS, *MICROMINIATURIZATION (ELECTRONICS), *SEMICONDUCTORS, *THIN FILMS (STORAGE DEVICES), CONTAINERS, DIODES, EVAPORATION, HUMIDITY, INTEGRATED CIRCUITS, MANUFACTURING, MATERIALS, PROCESSING, RESISTANCE (ELECTRICAL), RESISTORS, SOLDERED JOINTS, SOLDERING, TEMPERATURE, TRANSISTORS, VACUUM APPARATUS

Distribution Statement : APPROVED FOR PUBLIC RELEASE