Accession Number : AD0286545

Title :   DEPOSITED CONNECTIONS AND WIRING

Corporate Author : MASSACHUSETTS INST OF TECH LEXINGTON LINCOLN LAB

Personal Author(s) : GUDITZ,E.A.

Report Date : 07 SEP 1962

Pagination or Media Count : 1

Abstract : Deposited connections a d wiring are evaluated ollowing application of the techni ue to various prototype electronic-computer equipment. The process was used chiefly in multi-layer transmission-line wiring and in pluggable circuit packages. The former was more successful in terms of ease of construction and immediate practical application. Two-layer etche transmission-line wiring, with deposited inter-layer connections in plated-through holes, is now in use in parts of the new FX-1 high-speed digital computer. In other applications deposited connections in blind plated holes were used to interconnect two-layer wiring for circuit packages and three-layer wiring for back panels. Conductors in flexi le flat cables ere interconnected with deposited connections by encapsulating and facing-off the ends of the stacked cables and selectively interconnecting conductors with photo-etched chemically-reduced and electroplated copper. Advantages, limitati ns, and processing details are discussed for each application. It is recommended that deposited connections be considered for additional applications in which it might be difficult, or impossible to employ conventional interconnection methods. (Author)

Descriptors :   *ELECTRIC CONNECTORS, *PACKAGED CIRCUITS, *PRINTED CIRCUITS, *SWITCHING CIRCUITS, BONDING, CIRCUITS, COMPUTER LOGIC, COMPUTERS, COPPER, DISCONNECT FITTINGS, ELECTROPLATING, ENCAPSULATION, PROCESSING, TRANSMISSION LINES

Distribution Statement : APPROVED FOR PUBLIC RELEASE