Accession Number : AD0287745

Title :   ELECTRONIC PACKAGED SUBASSEMBLIES USING MECHANICAL METHODS FOR ELECTRICAL INTERCONNECTIONS BY THE USE OF THE STEWART-WARNER ELECTRONICS MECHANICAL ASSEMBLY TECHNIQUE

Corporate Author : STEWART WARNER CORP CHICAGO ILL

Report Date : 17 MAY 1962

Pagination or Media Count : 1

Abstract : A method of assembly of electronic components into subassemblies without the use of molecular bonds is reported. The system is based on the premise that initial pressure will compress all contacts beyond the elastic limit, the retaining pressure will be sufficient to take up some elasticity at all contacts for the range of operating and service conditions, and that the available retaining medium elongation will be larger than that of all contact combinations in order to compensate for all variations such as material flow, temperature, curing, aging or setting. (Author)

Descriptors :   *ELECTRONIC EQUIPMENT, *PACKAGED CIRCUITS, MATERIALS, MECHANICAL PROPERTIES, PRESSURE, PRODUCTION

Distribution Statement : APPROVED FOR PUBLIC RELEASE