Accession Number : AD0465782
Title : AN ECONOMICAL FLAT PACKAGE FOR INTEGRATED CIRCUITS.
Descriptive Note : Interim development rept. no. 4, 15 Mar15 Jun 65.
Corporate Author : SIGNETICS CORP SUNNYVALE CA
Report Date : 17 JUN 1965
Pagination or Media Count : 14
Abstract : The ultrasonic bonding method was extensively reevaluated after observing in process bond failures. Corrective measures have been instituted and improvement is seen on initial testing. (Author)
Descriptors : (*INTEGRATED CIRCUITS, PACKAGING), (*PACKAGING, INTEGRATED CIRCUITS), BONDING, ULTRASONIC RADIATION, MANUFACTURING, COSTS, PROCESSING.
Distribution Statement : APPROVED FOR PUBLIC RELEASE