Accession Number : AD0465782

Title :   AN ECONOMICAL FLAT PACKAGE FOR INTEGRATED CIRCUITS.

Descriptive Note : Interim development rept. no. 4, 15 Mar15 Jun 65.

Corporate Author : SIGNETICS CORP SUNNYVALE CA

Report Date : 17 JUN 1965

Pagination or Media Count : 14

Abstract : The ultrasonic bonding method was extensively reevaluated after observing in process bond failures. Corrective measures have been instituted and improvement is seen on initial testing. (Author)

Descriptors :   (*INTEGRATED CIRCUITS, PACKAGING), (*PACKAGING, INTEGRATED CIRCUITS), BONDING, ULTRASONIC RADIATION, MANUFACTURING, COSTS, PROCESSING.

Distribution Statement : APPROVED FOR PUBLIC RELEASE