Accession Number : AD0474696
Title : INTEGRATED CIRCUIT THERMAL STUDY.
Descriptive Note : Final rept.,
Corporate Author : MOTOROLA INC SCOTTSDALE AZ MILITARY ELECTRONICS DIV
Personal Author(s) : Baum, J. R.
Report Date : 15 NOV 1965
Pagination or Media Count : 160
Abstract : Results of a study of the thermal considerations in monolithic silicon integral circuit devices are presented. Thermal instrumentation techniques using conventional thermocouples to measure chip temperatures and a method of implementing the use of base to emitter voltage versus temperature characteristic were developed. The usefulness of available infrared equipment was also evaluated. Digital computer implemented thermal analyses were investigated. Data are presented showing the magnitude of thermal gradients and thermal resistances for typical devices in a TO-5 case and in an all ceramic flat package. (Author)
Descriptors : (*INTEGRATED CIRCUITS, THERMAL PROPERTIES), SILICON, THERMOCOUPLES, TEMPERATURE, MEASUREMENT, VOLTAGE, INFRARED EQUIPMENT, THERMAL ANALYSIS, DIGITAL COMPUTERS, EMISSIVITY, RADIOMETERS, MICROSCOPES, CERAMIC MATERIALS, PACKAGED CIRCUITS, THERMAL CONDUCTIVITY, COMPUTER PROGRAMMING, TEST EQUIPMENT, WIRING DIAGRAMS, TRANSISTORS, BOUNDARY LAYER.
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE