Accession Number : AD0482059

Title :   EVALUATION OF FLIP/CHIP INTEGRATED CIRCUIT INTERCONNECTIONS.

Descriptive Note : Interim development rept. 16 Jan-16 Apr 66.

Corporate Author : COMPUTER CONTROL CO INC FRAMINGHAM MA

Report Date : 13 MAY 1966

Pagination or Media Count : 16

Abstract : The objective of this effort is to perform a critical evaluation of the Flip/Chip approach to interconnecting integrated chip circuits within a common package. The simulation of the package thermal characteristics has been completed. Work is in progress on a matrix experiment on aluminum-to-aluminum ultrasonic bonding conditions. Solder pads have been prepared on 7059 glass substrates and on silicon chips for solder bonding experiments.

Descriptors :   *INTEGRATED CIRCUITS), (*CIRCUIT INTERCONNECTIONS, THERMAL PROPERTIES, ALUMINUM, ULTRASONIC WELDING, SOLDERING, GLASS, SUBSTRATES, SILICON, PERFORMANCE(ENGINEERING), ELECTRICAL RESISTANCE, ALUMINUM COMPOUNDS, OXIDES, BERYLLIUM COMPOUNDS.

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE