Accession Number : AD0485078
Title : EVALUATION PROCEDURES FOR RELIABILITY, MAINTAINABILITY. AND EFFECTIVENESS OF MICROELECTRONICS.
Descriptive Note : Final technical documentary rept.,
Corporate Author : BURROUGHS CORP PAOLI PA FEDERAL AND SPECIAL SYSTEMS GROUP
Personal Author(s) : Beadling, D. ; Casey, C. ; Dunne, D. ; Faulis, D ; Hornstein, M.
Report Date : MAY 1966
Pagination or Media Count : 184
Abstract : This is the final report on a study conducted to define and detail the present practices, characteristics and problems of the microelectronic industry relevant to the establishment of evaluation procedures for microelectronic components and equipment. Both manufacturers and users of semiconductor integrated circuits and film hybrid circuits were surveyed. Several significant conclusions have been derived from the survey experience and are reported. However, by far the dominant finding is a critical need for standardization in the integrated circuit area. This is particularly true in the dimensional aspect of device packaging and in the reliability testing area of procurement specifications. The need for standardization is twofold. First, reliability and cost effectiveness of present and future microelectronic components and equipment can be improved considerably as a result of such standardization. Second, such standardization would reduce the intuitive content of any comparative evaluation of microelectronics by providing additional quantitative bases for evaluation procedures. The beneficial effects of standardization will be felt in major military systems involving high production volume. (Author)
Descriptors : (*INTEGRATED CIRCUITS, MANUFACTURING), (*MOLECULAR ELECTRONICS, RELIABILITY(ELECTRONICS)), SEMICONDUCTORS, STANDARDIZATION, SILICON, DEPOSITION, TEST EQUIPMENT, FAILURE(ELECTRONICS), DIRECT CURRENT, ALTERNATING CURRENT, ELECTRICAL IMPEDANCE, AIRBORNE, MAINTAINABILITY, MICROELECTRONICS, SEMICONDUCTING FILMS, COST EFFECTIVENESS.
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE