Accession Number : AD0487339
Title : EVALUATION OF FLIP/CHIP INTEGRATED CIRCUIT INTERCONNECTIONS.
Descriptive Note : Interim development rept. 17 Apr-16 Jul 66.
Corporate Author : HONEYWELL INC FRAMINGHAM MA COMPUTER CONTROL DIV
Report Date : 15 AUG 1966
Pagination or Media Count : 19
Abstract : The objective of this program is to perform a critical evaluation of the Flip-Chip approach to interconnecting integrated chip circuits within a common package. The aluminum-to-aluminum ultrasonic bonding matrix experiment has been completed. A thermal soldering machine and registration jig have been designed. A Flip-Chip module has been constructed and packaging problems investigated. (Author)
Descriptors : (*INTEGRATED CIRCUITS, CIRCUIT INTERCONNECTIONS), ULTRASONIC WELDING, BONDING, ALUMINUM, SOLDERING, MODULES(ELECTRONICS), JIGS, MANUFACTURING, SUBSTRATES, ULTRASONIC RADIATION.
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE