Accession Number : AD0611757

Title :   A STUDY OF HIGH MODULUS, HIGH STRENGTH FILAMENT MATERIALS BY DEPOSITION TECHNIQUES.

Descriptive Note : Final rept. for 1 Nov 63-31 Oct 64,

Corporate Author : GENERAL TECHNOLOGIES CORP RESTON VA

Personal Author(s) : Davies,L. G. ; Withers,J. C. ; Bazzarre,D. F.

Report Date : 01 JAN 1965

Pagination or Media Count : 39

Abstract : A research program was initiated for the investigation of certain high modulus, high strength, low density materials in filament form. The primary objective of the investigation was to establish feasibility for depositing the desired materials by state-of-the-art vapor deposition techniques upon a substrate in filament form. The following materials were selected for study on the basis of their high modulusto-density ratio: boron carbide, silicon carbide, boron, titanium boride, titanium carbide, beryllium, beryllium oxide, and aluminum oxide. The filaments were characterized by their physical appearance and by the measurement of their tensile strength. The modulus of elasticity and density was measured on representative samples of each group. All candidate materials were successfully deposited. The boron carbide, silicon carbide, and boron deposition reactions produced high quality coatings at reasonable deposition rates. The other materials produced filaments of generally lower strengths, probably due, in part, to the high crystallinity of the coating. Beryllium, beryllium oxide, and aluminum oxide had very low deposition rates. The tensile strength of the boron carbide filaments ranged from 480,000 psi to 1,130,000 psi on 0.001'' tungsten substrates. The silicon carbide had tensile strength to 2,000,000 psi, and boron had strengths to 1,900,000 psi. Silicon carbide had the highest modulus of elasticity (up to 800,000,000 psi) of the materials studied, while titanium carbide with measured modulus of less than 20,000,000 psi had the lowest. (Author)

Descriptors :   (*FILAMENTS, MANUFACTURING), (*REINFORCING MATERIALS, FILAMENTS), VAPOR PLATING, BORON COMPOUNDS, SILICON COMPOUNDS, CARBIDES, BORON, TITANIUM COMPOUNDS, BORIDES, BERYLLIUM, BERYLLIUM COMPOUNDS, ALUMINUM COMPOUNDS, OXIDES, TENSILE PROPERTIES, COATINGS, ELASTIC PROPERTIES, DENSITY

Distribution Statement : APPROVED FOR PUBLIC RELEASE