Accession Number : AD0623284
Title : MICROBONDS FOR HYBRID MICROCIRCUITS.
Descriptive Note : Quarterly rept. no. 4, 1 Nov 64-31 Jan 65,
Corporate Author : HAMILTON STANDARD BROAD BROOK CONN ELECTRONICS DEPT
Personal Author(s) : Green,R. J. ; Rogers,S. L.
Report Date : 31 JAN 1965
Pagination or Media Count : 89
Abstract : A statistical analysis of the reproducibility of microbonds between gold wire and Au/Cr films on a variety of substrates are presented. These bonding material combinations have been demonstrated to produce high strength with conductors of 0.0007, 0.002 and 0.005 inch diameter gold wires where the total film thickness exceeds 15,000 A. The effects of substrate materials have been shown to be secondary unless the substrate material is sensitive to thermal shock. Microbonds between gold wire and aluminum films on alumina, glass, silicon or exidised silicon substrates are not compatible with split tip welding. Details of test and evaluation programs on these microbonds are presented. Thermal aging studies on a variety of microbonds are discussed. Thermal aging of the gold to gold systems showed insignificant changes in bond resistance until diffusion and/or oxidation at the higher temperatures prevented further test readings. Bonds between gold and aluminum films deteriorated rapidly at aging temperatures as low as 125C. The factual data also includes a discussion of the effects of thermal shock on a number of microbonds. (Author)
Descriptors : (*BONDING, MICROELECTRONICS), (*ELECTRIC CONNECTORS, BONDING), (*MICROELECTRONICS, CIRCUITS), CIRCUIT INTERCONNECTIONS, GOLD, ELECTRIC WIRE, METAL FILMS, CHROMIUM, NICKEL, STATISTICAL ANALYSIS, ALUMINUM, AGING(MATERIALS), WELDING, BONDED JOINTS, MECHANICAL PROPERTIES
Distribution Statement : APPROVED FOR PUBLIC RELEASE