Accession Number : AD0623730
Title : THERMOELECTRIC JUNCTIONING PROJECT.
Descriptive Note : Progress rept. no. 3, 1 Oct-31 Dec 62,
Corporate Author : WHIRLPOOL CORP ST JOSEPH MICH RESEARCH AND ENGINEERING LABS
Personal Author(s) : Sickert,R. G.
Report Date : 31 JAN 1963
Pagination or Media Count : 17
Abstract : Work on surface film analysis has progressed to the point where the cathodic etch process is controllable and films of 50 to 100 angstroms thickness can be deposited. A gold reference standard was developed, however, a superior platinum standard is now in process of evaluation. Partial identification of constituents of the sputtered films was accomplished. Melting point determination of solders was made and a near ternary eutectic solder of bismuth, antimony and tin was produced and evaluated. Examination of microstructures of solders and solder joints is in process. Studies of reaction rates between bismuth telluride, solder and copper were initiated. Diffusion layers produced in joining with the ternary eutectic solder were shown after long exposure at 450F. Ultrasonic tinning of bismuth telluride was not successful. (Author)
Descriptors : (*THERMOELECTRICITY, MATERIALS), (*SOLDERING ALLOYS, MICROSTRUCTURE), FILMS, ELECTRODEPOSITION, SPUTTERING, SOLDERED JOINTS, EUTECTICS, REACTION KINETICS, BISMUTH ALLOYS, TELLURIUM ALLOYS, ANTIMONY ALLOYS, TIN ALLOYS, COPPER, MELTING POINT
Subject Categories : Non-electrical Energy Conversion
Properties of Metals and Alloys
Distribution Statement : APPROVED FOR PUBLIC RELEASE