Accession Number : AD0628230

Title :   PRODUCTION ENGINEERING MEASURE FOR SILICON OVERLAY TRANSISTORS.

Descriptive Note : Quarterly progress rept. no. 3, 1 Jul-30 Sep 65,

Corporate Author : MOTOROLA INC PHOENIX ARIZ SEMICONDUCTOR PRODUCTS DIV

Personal Author(s) : Kearkuff,Thomas ; Greer,Paul

Report Date : 30 SEP 1965

Pagination or Media Count : 32

Abstract : Progress during the reporting period consisted of the following: (1)Diffusion systems. Work was completed on the BBr3 base diffusion system, and system feasibility was determined. The emitter-gold emitter diffusion system was also evaluated for feasibility. (2) Wafer processing. The feasibility of using 1 1/2 inch wafers with slurry polish and chemical etch was investigated. (3) Wafer storage. Devices which had been stored in N2 for 15 days at various steps were processed and evaluated. (4) Assembly processing. Units were constructed using ultrasonic wire bonding of aluminum wire to bare kovar posts and deionized water boiling prior to encapsulation. (5) Reliability. Completed units were evaluated. (Author)

Descriptors :   (*TRANSISTORS, MANUFACTURING), (*SILICON, TRANSISTORS), DOPING, GOLD, CHEMICAL MILLING, PRECISION FINISHING, PROCESSING, ENCAPSULATION, ULTRASONIC RADIATION, BONDING, WIRE, ASSEMBLY, RELIABILITY(ELECTRONICS)

Subject Categories : Electrical and Electronic Equipment
      Fabrication Metallurgy

Distribution Statement : APPROVED FOR PUBLIC RELEASE