Accession Number : AD0632390
Title : MICROMINIATURIZATION MULTIPLANE INTERCONNECTIONS.
Descriptive Note : Quarterly technical progress rept. no. 1, 1 Jul-30 Sep 65,
Corporate Author : HUGHES AIRCRAFT CO FULLERTON CALIF
Personal Author(s) : Rhoades,William T.
Report Date : APR 1966
Pagination or Media Count : 141
Abstract : The purpose of this work is the development of interconnections for ultrahigh-speed-Micro-Circuit Module arrays. Four module packaging approaches for ultra high speed circuits, along with a new packaging technique, are presented and compared. High complexity arrays are discussed and analyzed from the viewpoint of cost and performance. Progress on the subassembly and assembly and assembly designs is described. Various power requirements and delay measurements on the ultra-high-speed gate are given. (Author)
Descriptors : (*MICROELECTRONICS, *CIRCUIT INTERCONNECTIONS), (*MODULES(ELECTRONICS), MICROELECTRONICS), PACKAGING, GATES(CIRCUITS), COMPUTER LOGIC, TRANSMISSION LINES, INTEGRATED CIRCUITS, PERFORMANCE(ENGINEERING), THERMAL PROPERTIES
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE