Accession Number : AD0634030

Title :   SEMICONDUCTOR WAFER-BONDER,

Corporate Author : HARRY DIAMOND LABS WASHINGTON D C

Personal Author(s) : Anstead,Robert J.

Report Date : APR 1966

Pagination or Media Count : 14

Abstract : A device for bonding semiconductor devices to headers is described. Individual dice are picked up from an indexing disc with a vacuum pencil and positioned over the header. The weight of the pencil serves as a pressure source on the transistor die while the heat is supplied through a filament heater. The bonding operation is carried out in a forming gas atmosphere. Construction of the instrument and operating procedures are described. (Author)

Descriptors :   (*SEMICONDUCTOR DEVICES, *BONDING), TRANSISTORS

Subject Categories : Electrical and Electronic Equipment
      Mfg & Industrial Eng & Control of Product Sys

Distribution Statement : APPROVED FOR PUBLIC RELEASE