Accession Number : AD0635183

Title :   LOW COST INTEGRATED CIRCUIT TECHNIQUES.

Descriptive Note : Progress rept. no. 3, 15 Dec 65-14 Mar 66 (Technical).

Corporate Author : PHILCO CORP LANSDALE PA

Personal Author(s) : Wagner, Sturger ; Walker,Mauro

Report Date : JUL 1966

Pagination or Media Count : 44

Abstract : Evaluation studies of evaporated and vapor plated glass have led to the recommendation that only the vapor plated glass process be used in continuing the remainder of the program. Vapor plated glass has shown superior properties as a dielectric and in mobile charge content. An important consideration is the compatibility of vapor plated glass with existing metalization systems. A number of construction methods have been evolved and proven feasible, although several problems remain. However, the problems are basically those of processing and thus capable of resolution during fabrication of the test vehicles. Continued improvements in batch assembly techniques have led to more reproducible and better defined solder joints. Further electrical evaluations have been made of devices to determine the effects of glassing. These evaluations have also evidenced the superiority of vapor plated glass. An error in one of the masks proved to be responsible for a saturation voltage problem. A specification question has arisen because of the rather wide range of leakage currents resulting from gold doping. This leakage current variation made the test vehicles which were constructed unsatisfactory for environmental testing. A revised approach to the final exploratory development models is recommended to permit emphasis on the construction techniques which utilize vapor plated glass. (Author)

Descriptors :   (*INTEGRATED CIRCUITS, MANUFACTURING), (*ENCAPSULATION, INTEGRATED CIRCUITS), COSTS, VAPOR PLATING, GLASS, PERFORMANCE(ENGINEERING)

Subject Categories : Electrical and Electronic Equipment
      Ceramics, Refractories and Glass

Distribution Statement : APPROVED FOR PUBLIC RELEASE