Accession Number : AD0635814

Title :   PRODUCTION ENGINEERING MEASURE FOR SILICON OVERLAY TRANSISTORS.

Descriptive Note : Quarterly progress rept. no. 4, 1 Oct-31 Dec 65.

Corporate Author : MOTOROLA INC PHOENIX ARIZ SEMICONDUCTOR PRODUCTS DIV

Personal Author(s) : Cassidy, Michael ; Greer,Paul

Report Date : 31 DEC 1965

Pagination or Media Count : 37

Abstract : Progress during the past quarter has consisted of the following: (1) Wafer Preparation: Processing of 1 1/2-inch slurry-polished and chemically etched wafers using the new preohmic two-step photoresist process. (2) Mask Resolution and Alignment: Vertical and horizontal dimensional inspection of masks to eliminate mask variations. (3) Deionized Water Boil: Evaluation of ultrasonically wire-bonded devices after subjection to deionized water boil. (4) Wire Bonding: Evaluation of units fabricated using a Sono Bond ultrasonic bonder. (5) Diffusion Systems: Final evaluation of the BCl3 system. Emitter diffusion employing a controlled POCl3 source temperature. (6) Reliability Evaluation: Evaluation of completed units. (Author)

Descriptors :   (*TRANSISTORS, MANUFACTURING), (*SILICON, TRANSISTORS), DISKS, PREPARATION, BONDING, DIFFUSION, STORAGE, RELIABILITY(ELECTRONICS), ULTRASONIC WELDING, CHEMICAL MILLING, ETCHING, ELECTRIC TERMINALS

Subject Categories : Electrical and Electronic Equipment
      Mfg & Industrial Eng & Control of Product Sys

Distribution Statement : APPROVED FOR PUBLIC RELEASE