Accession Number : AD0636193
Title : INVESTIGATION OF PLATINGS OF ELECTRICAL CONTACTS.
Descriptive Note : Technical memo.
Corporate Author : NAVAL APPLIED SCIENCE LAB BROOKLYN N Y
Report Date : 08 JUL 1966
Pagination or Media Count : 29
Abstract : MIL-C-26636 size 16 and 20 pin and socket contacts were electroplated with gold over silver, gold over nickel, gold over copper, rhodium over nickel and rhodium over silver. Plated contacts were wired and assembled in a modified louvered Stevenson Screen and installed at the NASL marine environmental site at Ft. Tilden, N.Y. mounted on a supporting structure facing the ocean without obstruction, approximately 500 feet from the shore line and 40 feet above M.L.W. Analysis of tarnish films deposited on exposed copper plates during the initial two months at the Ft. Tilden test site indicates a suitable marine environment free of sulphide contamination. Contact resistance measurements on contacts mated 100 times as compared to contacts mated once, prior to exposure, show no significant difference except for a 30% increase for those plated with rhodium over nickel. The contact resistance measurements made during the first two months of exposure indicate a slight increase in the average contact resistance of all contacts. (Author)
Descriptors : (*ELECTROPLATING, *ELECTRIC CONNECTORS), NAVAL EQUIPMENT, ENVIRONMENTAL TESTS, CORROSION, CORROSION INHIBITION, ELECTRICAL RESISTANCE, FILMS, GOLD, SILVER, NICKEL, COPPER, RHODIUM, PERFORMANCE(ENGINEERING)
Subject Categories : Electrical and Electronic Equipment
Properties of Metals and Alloys
Distribution Statement : APPROVED FOR PUBLIC RELEASE