Accession Number : AD0637819
Title : HIGH RELIABILITY MICROCIRCUIT MODULES.
Descriptive Note : Interim rept. no. 1, 1 Jun 64-31 Jan 66.
Corporate Author : HAMILTON STANDARD DIV UNITED AIRCRAFT CORP BROAD BROOK CONN
Personal Author(s) : Riben,A. R. ; Antalik,R. E.
Report Date : AUG 1966
Pagination or Media Count : 89
Abstract : Reliability of the Hamilton Standard MicroCircuit Module was studied. MicroCircuit Modules containing only transistors, containing transistors and thin film resistors and capacitors and containing functioning circuits (both hybrid and monolithic circuits) were studied. The tests consisted of high temperature storage, thermal cycling and mechanical environmental stress. The results of these tests were compared to the results of similar tests on identical transistors (fabricated in the same diffusion run) packaged in TO-18 cans. The study showed that the microcircuit module packaging scheme is as reliable as the TO-18 can. More specifically, it was found that the failure rate for transistors packaged in the microcircuit module and stored at 150C was 0.028%/1000 hours. The effect of the formation of gold-aluminum intermetallic compounds at the junction of gold leads and aluminum contact films is discussed. It is shown that proper process control can reduce but not eliminate this effect. This study has shown that highly reliable hybrid and monolithic circuits can be packaged in the Hamilton Standard MicroCircuit Module, offering substantial weight and volume reduction for complex electronic systems. (Author)
Descriptors : (*MICROELECTRONICS, *MODULES(ELECTRONICS)), RELIABILITY(ELECTRONICS), TRANSISTORS, INTEGRATED CIRCUITS, FILMS, SEMICONDUCTOR DEVICES, RESISTORS, CAPACITORS, CIRCUITS, GOLD ALLOYS, ALUMINUM ALLOYS, CIRCUIT INTERCONNECTIONS
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE