Accession Number : AD0643969

Title :   COST RELIABILITY FACTORS IN HYBRID CIRCUIT PACKAGING,

Corporate Author : ROME AIR DEVELOPMENT CENTER GRIFFISS AFB N Y

Personal Author(s) : McCormick,John E.

Report Date : OCT 1966

Pagination or Media Count : 23

Abstract : Factors that affect reliability, (1) materials, (2) chip mounting techniques, (3) connecting techniques; a comparative reliability rating; factors that affect cost, (1) assembly techniques, (2) alinement techniques, (3) repairability, (4) yield; comparative cost rating; hybrid packing figure of merit.

Descriptors :   (*PACKAGED CIRCUITS, RELIABILITY(ELECTRONICS)), INTEGRATED CIRCUITS, COST EFFECTIVENESS, MICROELECTRONICS, SUBSTRATES, MANUFACTURING, FILMS, SILICON, BONDING

Subject Categories : Economics and Cost Analysis
      Electrical and Electronic Equipment
      Mfg & Industrial Eng & Control of Product Sys

Distribution Statement : APPROVED FOR PUBLIC RELEASE