Accession Number : AD0647464
Title : MICROBONDS FOR HYBRID MICROCIRCUITS.
Descriptive Note : Final rept. no. 9, 1 Feb 64-30 Apr 66,
Corporate Author : UNITED AIRCRAFT CORP BROAD BROOK CONN HAMILTON STANDARD ELECTRONICS DEPT
Personal Author(s) : Riben,A. R. ; Sherman,S. L.
Report Date : JAN 1967
Pagination or Media Count : 237
Abstract : The overall objective of the program was the development of reliable high yield processes for bonding fine wires of gold and aluminum to gold-chromium and aluminum films on various substrates such as alumina, sapphires, and oxidized silicon. Furthermore, techniques were to be developed and evaluated for fabricating Micro-Circuit Modules (MCM) stacks and joining standard flat-packs to multilayer circuit boards by means of resistance welding and for ultrasonically bonding of flip-chip transistors to gold-chromium films on as-fired alumina. Fine wire bonds of aluminum wire to aluminum films made by ultrasonic bonding were studied. Statistical analysis of the quality and reproducibility of these bonds is presented. Also, a summary of the results on the fine wire microbonds studied during the program is presented. The application of parallel gap welding to the fabrication of MCMs was demonstrated as a practical technique for prototype or limited production of MCMs. Welding of MCM stacks consisting of alumina, glazed alumina, Be0 and sapphire wafers were studied. The parallel-gap welding of flat-packs to multilayer wiring boards having surface layers of gold-nickel plated copper, gold plated nickel and alnifer conductors were studied. Statistical comparisons of the quality and reproducibility of these bonds are presented. The evaluation of a limited study of the mechanical quality and performance of ultrasonically bonded flip-chips is presented. (Author)
Descriptors : (*CIRCUIT INTERCONNECTIONS, BONDING), (*MICROELECTRONICS, CIRCUIT INTERCONNECTIONS), WELDING, ULTRASONIC WELDING, WIRE, MODULES(ELECTRONICS), SUBSTRATES, FILMS, METAL FILMS, GOLD, ALUMINUM, CHROMIUM
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE