Accession Number : AD0648420

Title :   ENCAPSULATION OF ELECTRONIC PARTS IN PLASTICS: A REVIEW,

Corporate Author : PLASTICS TECHNICAL EVALUATION CENTER DOVER N J

Personal Author(s) : Molzon,Arnold E.

Report Date : FEB 1967

Pagination or Media Count : 67

Abstract : The advances and trends in the plastics encapsulation of electronic parts and circuits are reviewed. In less than 20 years this industry has developed into a high production operation. Included in this report are: types of plastics used, material requirements and material consumption. Known material suppliers and equipment suppliers are listed and their products identified. Also tabulated are 47 pertinent specifications, 111 contracts (with reports), and 53 government laboratory reports. These reflect the materials research and development in the Department of Defense, in NASA, and in industry. The availability of information is also discussed. The report contains a bibliography of 207 items on encapsulation.

Descriptors :   (*ELECTRONIC EQUIPMENT, ENCAPSULATION), (*ENCAPSULATION, PLASTICS), COATINGS, FOAM, EMBEDDING SUBSTANCES, POLYMERS, CASTING, MATERIAL FORMING, MOLDINGS, THERMAL PROPERTIES

Subject Categories : Plastics

Distribution Statement : APPROVED FOR PUBLIC RELEASE