Accession Number : AD0650032

Title :   COMPLEMENTARY HEATING OF DENSELY PACKAGED MICROCIRCUITS.

Descriptive Note : Research and development rept., for Sept-Nov 66,

Corporate Author : NAVY ELECTRONICS LAB SAN DIEGO CALIF

Personal Author(s) : Dean,H. F.

Report Date : 06 FEB 1967

Pagination or Media Count : 20

Abstract : Some microcircuits dissipate as much as equivalent circuits using discrete transistors and resistors. Dense packaging and the resultant complementary heating therefore create reliability problems similar to those experienced with discrete components. (Author)

Descriptors :   (*CIRCUITS, MICROELECTRONICS), (*MICROELECTRONICS, HEATING), RELIABILITY(ELECTRONICS), MODULES(ELECTRONICS)

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE