Accession Number : AD0651484

Title :   HIGH-INFORMATION-DENSITY STORAGE SURFACES.

Descriptive Note : Quarterly rept. no. 7, 1 Oct 66-31 Dec 66,

Corporate Author : STANFORD RESEARCH INST MENLO PARK CALIF

Personal Author(s) : Rogers,Kendal T. ; Kelly,John

Report Date : APR 1967

Pagination or Media Count : 37

Abstract : This program is now devoted to the preparation and investigation of two novel kinds of electron-beam addressable storage elements of about micron size and densely packed arrays of these elements. One kind of element, called a micro-cap, consists of an isolated microcapacitor at the bottom of a hole in a metal-dielectric film sandwich. The other kind, called a micro-ring, consists of an isolated metal film ring embedded concentrically with a hole in a metal-dielectric film sandwich. During this quarter, several techniques for storage and readout on randomly distributed micro-cap storage elements were demonstrated. One storage technique probably involved bombardment-induced conductivity (BIC); however, the presence of BIC in the experiment was not conclusively proved. A new mildly bakeable (400C) field-emitter lens with molybdenum elements, and its associated commercial ultra-high-vacuum system, is being readied for operation. Work on storage structures is proceeding in several concurrent directions. First, the preparation of mosaics having randomly distributed micro-cap elements is continuing. Second, several techniques for producing isolated rings for micro-ring elements are under consideration, and preliminary experimental work on one technique has yielded promising results. Third, efforts are continuing on electron beam techniques for making regular arrays of densely-packed storage elements starting from raster exposure of an electron sensitive resist. (Author)

Descriptors :   (*DATA STORAGE SYSTEMS, *MICROELECTRONICS), (*THIN FILM STORAGE DEVICES, FEASIBILITY STUDIES), REFRACTORY MATERIALS, MEMORY DEVICES, ELECTRON BEAMS, CAPACITORS, DIELECTRIC FILMS, FILMS

Subject Categories : Miscellaneous Materials
      Computer Hardware

Distribution Statement : APPROVED FOR PUBLIC RELEASE