Accession Number : AD0651545

Title :   A DIFFUSION BONDING PROGRAM.

Descriptive Note : Final rept., 1 Feb 66-31 Dec 66,

Corporate Author : HONEYWELL INC ST PETERSBURG FLA

Personal Author(s) : Clark,P. R. ; Baker,Henry

Report Date : APR 1967

Pagination or Media Count : 51

Abstract : An evaluation was made of diffusion bonding processes and techniques. The use of evaporated aluminium patterns on polyimide ('H') film provided the interconnecting metallization. This report summarizes the work, including the development of optimum bonding parameters, the fabrication of a significant number of bonds, and the testing of these bonds. (Author)

Descriptors :   (*DIFFUSION BONDING, CIRCUIT INTERCONNECTIONS), (*INTEGRATED CIRCUITS, DIFFUSION BONDING), ALUMINUM, VAPOR PLATING, SUBSTRATES, POLYAMIDE PLASTICS, FILMS, PERFORMANCE(ENGINEERING), MANUFACTURING, BONDED JOINTS

Subject Categories : Electrical and Electronic Equipment
      Fabrication Metallurgy
      Plastics

Distribution Statement : APPROVED FOR PUBLIC RELEASE