Accession Number : AD0655781
Title : RELIABILITY TEST PROGRAM OF ULTRASONIC FACE DOWN BONDING TECHNIQUE.
Descriptive Note : Final rept., 10 Nov 65-31 Jan 67,
Corporate Author : SPERRY RAND CORP PHILADELPHIA PA UNIVAC DIV
Personal Author(s) : Moore,Robert P.
Report Date : JUN 1967
Pagination or Media Count : 94
Abstract : A study was made to determine the overall reliability of its face-down-bonding process and to determine whether the bonding process damages the chip. The ultrasonic direct-bonding process was used to fabricate approximately 900 test samples for this study. Samples were subjected to the following tests: shear, mechanical shock, thermal shock, vibration, centrifuge, high-temperature storage, elevated-temperature back bias, step stress and comparison, and temperature and humidity. Defective units were examined for causes of failure. The test results indicate that the stresses applied during bonding do not affect circuit operation. The bond failure rate was high, but the distribution of failures suggests that this was due to inadequate substrate process control rather than inherent problems with face-down bonding. The substrate interconnect wires corroded in high-temperature and high-humidity ambients. Several potential solutions to this problem are suggested. (Author)
Descriptors : (*ULTRASONIC WELDING, *INTEGRATED CIRCUITS), CIRCUIT INTERCONNECTIONS, BONDING, SUBSTRATES, RELIABILITY
Subject Categories : Electrical and Electronic Equipment
Mfg & Industrial Eng & Control of Product Sys
Distribution Statement : APPROVED FOR PUBLIC RELEASE