Accession Number : AD0671879

Title :   THERMOCOMPRESSION BONDING OF GOLD WIRE FOR MICROELECTRONIC CIRCUITS,

Corporate Author : NAVAL AVIONICS FACILITY INDIANAPOLIS IND

Personal Author(s) : Higbie,Thomas E.

Report Date : 26 OCT 1967

Pagination or Media Count : 35

Abstract : The report details a technique for interconnecting master die integrated circuits using thermocompression bonding. Primary coverage is given to specific results achieved and the techniques used. (Author)

Descriptors :   (*INTEGRATED CIRCUITS, *SPOT WELDING), (*DIFFUSION BONDING, *GOLD), SEMICONDUCTOR DEVICES, SUBSTRATES, TEMPERATURE, TIME, PRESSURE, STATISTICAL ANALYSIS, PHYSICAL PROPERTIES, MANUFACTURING

Subject Categories : Electrical and Electronic Equipment
      Fabrication Metallurgy

Distribution Statement : APPROVED FOR PUBLIC RELEASE