Accession Number : AD0677570

Title :   YIELD STRESS-CONTROLLED DIFFUSION BONDING OF CABLE WIRES TO connectors,

Corporate Author : BENDIX CORP SOUTHFIELD MICH BENDIX RESEARCH LABS

Personal Author(s) : Rhee,Seong K. ; Spurgeon,William M.

Report Date : 1968

Pagination or Media Count : 10

Abstract : In the present state of the art, cable wires are joined to connector pins or sockets by soldering, crimping, or welding. In order to overcome the various disadvantages of the above methods, a feasibility study of a fourth-generation joining technique was undertaken. This development program has resulted in a solid state joining technique called yield-point bonding, requiring little time (about a second), temperatures below the melting points of the metals being joined, and pressures above their yield points. The method is as fast as welding but is free of cast structures, weld spatters, and notches that act as stress raisers. (Author)

Descriptors :   (*ELECTRIC CABLES, MANUFACTURING), (*ELECTRIC WIRE, DIFFUSION BONDING), STRESSES, JOINING, METALS, TEMPERATURE, DEFORMATION, FEASIBILITY STUDIES, PRESSURE, COPPER ALLOYS, MICROSTRUCTURE, BRASS, TENSILE PROPERTIES, ALUMINUM ALLOYS

Subject Categories : Electrical and Electronic Equipment
      Fabrication Metallurgy

Distribution Statement : APPROVED FOR PUBLIC RELEASE