Accession Number : AD0681826

Title :   ELECTRONIC MINIATURIZED PACKAGING AND COOLING RESEARCH.

Descriptive Note : Engineering research rept.,

Corporate Author : GENERAL DYNAMICS/CONVAIR SAN DIEGO CALIF

Personal Author(s) : Frindt,R. J.

Report Date : 31 MAR 1961

Pagination or Media Count : 24

Abstract : A report is given of the progress in design of a packaging concept for a ground based computer. This particular type of computer was chosen because of its immediate potential. Cooling of the components is a major consideration in directing the design concept. Manufacturing problems and reliability are also of prime importance. Encapsulation materials and methods, welding of component leads and dip soldering are all investigated from a cost and reliability standpoint. Standard, inexpensive components were used to keep costs competitive and because of their already proven reliability as compared with the newer types now being introduced. (Author)

Descriptors :   (*COMPUTERS, *PACKAGING), MINIATURE ELECTRONIC EQUIPMENT, COOLING, ENCAPSULATION, PRINTED CIRCUITS, WELDING, SOLDERING, MANUFACTURING, COSTS, RELIABILITY(ELECTRONICS), MODULES(ELECTRONICS)

Subject Categories : Computer Hardware

Distribution Statement : APPROVED FOR PUBLIC RELEASE