Accession Number : AD0682484

Title :   THERMAL SHOCK ANALYSIS OF STANDARD HARDWARE MODULES,

Corporate Author : NAVAL AVIONICS FACILITY INDIANAPOLIS IND

Personal Author(s) : Homicz,Gregory F.

Report Date : 01 AUG 1968

Pagination or Media Count : 26

Abstract : The report is a theoretical analysis of stresses exerted on connector pin solder joints of NAFI Standard Hardware Modules, Style 1-A, during thermal shock due to varying coefficients of expansion between adjacent materials. An estimate is also made of the solder joint strength and a comparison made between the two. Although both sets of calculations are worst case analyses (maximum thermal stress vs. minimum joint strength for temperature extremes of -55C to +125C), it appears that the solder joint will always withstand forces equal to several times those induced by thermal elongation. (Author)

Descriptors :   (*ELECTRIC CONNECTORS, STRESSES), MODULES(ELECTRONICS), THERMAL SHOCK, SOLDERED JOINTS, THERMAL STRESSES, CIRCUIT INTERCONNECTIONS, TENSILE PROPERTIES

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE