Accession Number : AD0689224
Title : FAILURE MECHANISMS IN PLASTIC ENCAPSULATED MICROCIRCUITS.
Descriptive Note : Technical rept.,
Corporate Author : ROME AIR DEVELOPMENT CENTER GRIFFISS AFB N Y
Personal Author(s) : Tamburrino,Alfred L. ; Kapfer,Vincent C.
Report Date : MAY 1969
Pagination or Media Count : 34
Abstract : This paper deals with the question of military acceptance of microcircuits encapsulated in plastic materials. A discussion of military applications and requirements and their relation to device qualification testing and screening is given. It is pointed out that qualification tests are based neither upon absolute minimum standards nor validly derived acceleration factors, but on experience with similar devices, and knowledge of the expected capabilities of good devices. Epoxy, phenolic, and silicone encapsulated microcircuits have been subjected to a variety of high stress tests and four basic types of failures observed: external surface conduction, internal (silicon chip) surface effects, aluminum metallization corrosion, and bond breakage due to thermal mismatch. (Author)
Descriptors : (*INTEGRATED CIRCUITS, RELIABILITY(ELECTRONICS)), TEST METHODS, ENCAPSULATION, EPOXY RESINS, PHENOLIC PLASTICS, SILICONE PLASTICS, THERMAL STRESSES, SALT SPRAY TESTS, LIQUID IMMERSION TESTS, STRESSES, CORROSION, ALUMINUM ALLOYS, FAILURE(MECHANICS)
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE