Accession Number : AD0689753
Title : THICK FILM CONDUCTOR FUNCTION INKS AND PASTES FOR MICROELECTRONICS APPLICATIONS.
Descriptive Note : Interim rept.,
Corporate Author : HUGHES AIRCRAFT CO CULVER CITY CALIF ELECTRONIC PROPERTIES INFORMATION CENTER
Personal Author(s) : Milek,John T.
Report Date : 01 FEB 1968
Pagination or Media Count : 33
Abstract : The report was prepared in response to a request for information and data on conductive ink and paste formulations used in microelectronics technology. These inks and pastes are usually applied to ceramin substrates, resistor areas, capacitor areas for electrical termination purposes by the so-called silkscreen process to form conducting regions or areas and in combination form the microcircuit (including hybrid as well as monolithic). (Author)
Descriptors : (*MICROELECTRONICS, ELECTRICAL CONDUCTIVITY), (*SUBSTRATES, *METAL COATINGS), METAL FILMS, INKS, RELIABILITY(ELECTRONICS), GOLD, PLATINUM, SILVER, PALLADIUM, HEAT TREATMENT, AGING(MATERIALS), THERMOSETTING PLASTICS, MASKING, ADHESION
Subject Categories : Metallurgy and Metallography
Distribution Statement : APPROVED FOR PUBLIC RELEASE