Accession Number : AD0699344

Title :   LOW TCR FILM RESISTORS FOR CIRCUIT APPLICATIONS,

Corporate Author : HARRY DIAMOND LABS WASHINGTON D C

Personal Author(s) : Isler,William E. ; Kitchman,Lester A.

Report Date : OCT 1969

Pagination or Media Count : 37

Abstract : The report concerns vacuum-deposited resistive films for possible use in circuits requiring low-temperature-coefficient components. Films were deposited by both ordinary and 'flash' techniques from an alloy of Ni, Cr, Cu, and Al with a TCR in the bulk of plus or minus 5 ppm/C. The nonflash experiments showed that the film TCR's improved from +250 ppm/C for a film Ni/Cr ratio of 1.3 to +20 ppm/C for a ratio of 3.4. Films deposited onto Corning 7059 glass were more stable than those deposited onto soda-lime glass. The composition for the nonflash films was not so reproducible as that for the flash-deposited films, which were characterized by negative TCR's for sheet resistivities higher than 100 ohms/square. The flash technique was of the particle by particle type, which results in films having appreciable amounts of entrapped gases. This suggests another method of controlling TCR since resistance values decrease and the TCR's increase as gases are baked out. (Author)

Descriptors :   (*FIXED RESISTORS, METAL FILMS), OSCILLATORS, VAPOR PLATING, VACUUM APPARATUS, TEMPERATURE, ELECTRICAL RESISTANCE, ALUMINUM ALLOYS, CHROMIUM ALLOYS, COPPER ALLOYS, NICKEL ALLOYS

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE