Accession Number : AD0704925

Title :   PACKAGED CIRCUITS. VOLUME I.

Descriptive Note : Report bibliography Mar 59-Feb 69.

Corporate Author : DEFENSE DOCUMENTATION CENTER ALEXANDRIA VA

Report Date : APR 1970

Pagination or Media Count : 159

Abstract : Selective references include: compatible techniques for integrated circuitry; results of studies to determine optimum packaging techniques for the electronic equipment and the shock levels that the different packages and certain electronic components could withstand; a system for computer-aided selection and assignment of electronic modules; an electronic packaging program was initiated to develop and evaluate integrated circuit packaging techniques applicable to unmanned scientific spacecraft data system; and all aspects of microcircuit packaging are studied and each of the three basic approaches to the packaging of microcircuits are investigated and evaluated, namely, type of containers, glass and metal flat packages, and encapsulated type packages. (Author)

Descriptors :   (*PACKAGED CIRCUITS, *BIBLIOGRAPHIES), PACKAGING, ELECTRONIC EQUIPMENT, INTEGRATED CIRCUITS, MICROELECTRONICS, RELIABILITY(ELECTRONICS), MODULES(ELECTRONICS), PRINTED CIRCUITS, MOLECULAR ELECTRONICS, ELECTRIC CONNECTORS, MANUFACTURING, WELDING, SEMICONDUCTOR DEVICES, ENCAPSULATION, COMPUTERS, DATA STORAGE SYSTEMS, DATA PROCESSING, COMPUTER LOGIC

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE