Accession Number : AD0707295

Title :   OBTAINING THIN COPPER-TITANIUM ALLOY FILMS BY VACUUM DEPOSITION,

Corporate Author : FOREIGN TECHNOLOGY DIV WRIGHT-PATTERSON AFB OHIO

Personal Author(s) : Pilyankevich,A. N. ; Abramyan,G. K.

Report Date : 01 MAY 1970

Pagination or Media Count : 12

Abstract : A method is described for preparing thin films of a given compound by the simulataneous evaporation of the components from 2 sources. The rates of evaporation of Cu and Ti were determined experimentally under conditions of vacuum sputtering, and equations are given which describe the dependence of the rate on temperature. The sputtered films are a metastable solid solution of Ti and Cu formed as the result of quenching the vapor on the substrate. The parameter of the solid solution, a equals 3.623 A., indicates that the concentration of dissolved Ti is close to the value given under the sputtering conditions (5 wt. percent). (Author)

Descriptors :   (*METAL FILMS, *VAPOR PLATING), VACUUM APPARATUS, COPPER ALLOYS, TITANIUM ALLOYS, USSR, SPUTTERING

Subject Categories : Metallurgy and Metallography
      Fabrication Metallurgy

Distribution Statement : APPROVED FOR PUBLIC RELEASE