Accession Number : AD0714702
Title : Reliability Investigation of Thermal Stress/Fatigue Failure in Multilayer Interconnection Boards.
Descriptive Note : Final technical rept. Mar 69-May 70,
Corporate Author : IBM FEDERAL SYSTEMS DIV OWEGO N Y ELECTRONICS SYSTEMS CENTER
Personal Author(s) : Hurley,Harvey C. ; Strong,Thomas M. ; Young,Malcolm A.
Report Date : OCT 1970
Pagination or Media Count : 102
Abstract : Results are reported on the failure mechanisms of multilayer interconnection boards (MIBs) subjected to long-term temperature-cycling tests. The underlying failure process, consisting of low-cycle copper fatigue and leading to circuit open due to fracture, was found to occur at different rates and in different locations as a function of: (1) MIB design geometry and material parameters; (2) manufacturing process parameters; and (3) temperature cycling test profile values. Of particular interest is the presentation of comparative test results showing that straight-wall PTH (plated-through-hole) construction provides somewhat greater resistance to thermal fatigue than does etched-back PTH construction. Results are also given for comparative tests on early-vintage MIBs fabricated using polyimide materials and fluroborate-copper PTH plating. (Author)
Descriptors : (*PRINTED CIRCUITS, RELIABILITY(ELECTRONICS)), (*CIRCUIT INTERCONNECTIONS, RELIABILITY(ELECTRONICS)), THERMAL STRESSES, FAILURE(MECHANICS), TEST METHODS
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE