Accession Number : AD0715984

Title :   Stress Induced Intermittent Failures in Encapsulated Microcircuits.

Descriptive Note : Technical rept.,

Corporate Author : ROME AIR DEVELOPMENT CENTER GRIFFISS AFB N Y

Personal Author(s) : Haberer,John R.

Report Date : OCT 1970

Pagination or Media Count : 60

Abstract : The problem of temperature intermittent operation in encapsulated integrated circuit is discussed and a technique is presented which has been effective in detecting potential failures resulting from metallization, bond or lead wire temperature intermittents. These are the main causes of intermittent operation in encapsulated microcircuits at present, and this technique should lead to improvement in encapsulated device reliability if implemented as a screening or qualification test. The instrumentation used at RADC for this technique, called the Monitored Thermal Cycle Test (MTC), is presented and a proposed standard test method, based on this test is included as an Appendix. Several representative device failure analysis summaries are included to illustrate the cause of typical encapsulated integrated circuit intermittents resulting from failure of the lead wire-bond-interconnect system. (Author)

Descriptors :   (*INTEGRATED CIRCUITS, FAILURE(ELECTRONICS)), RELIABILITY(ELECTRONICS), ENCAPSULATION, CIRCUIT INTERCONNECTIONS

Subject Categories : Electrical and Electronic Equipment

Distribution Statement : APPROVED FOR PUBLIC RELEASE