Accession Number : AD0722043
Title : Reliability Evaluation of Plastic Integrated Circuits.
Descriptive Note : Final rept. 9 Jan 69-9 Sep 70,
Corporate Author : GENERAL MOTORS CORP KOKOMO IND DELCO ELECTRONICS DIV
Personal Author(s) : Bevington,John R. ; Cook,James P. ; Little,David R. ; Ingle,L. V.
Report Date : JAN 1971
Pagination or Media Count : 171
Abstract : The objectives of this study are to determine the suitability of representative,plastic-encapsulated integrated circuits for military applications, and to develop methods and techniques for assessing and assuring the reliability of such circuits. A series of screens and tests were performed on selected circuits, and detailed failure analyses were made to determine the failure modes and mechanisms characteristic of the various types of plastic encapsulations. This report includes detailed test results from long term tests and from short term highly accelerated tests. Comparisons are made between package types under the same stress conditions, between screened and unscreened groups, and between standard and accelerated test results. A stress to destruction test program, including equivalent hermetic types for direct comparison with plastic- encapsulated devices under selected accelerated test conditions, was also performed. (Author, modified-PL)
Descriptors : (*INTEGRATED CIRCUITS, *ENCAPSULATION), PLASTICS, RELIABILITY(ELECTRONICS), ACCEPTABILITY
Subject Categories : Electrical and Electronic Equipment
Distribution Statement : APPROVED FOR PUBLIC RELEASE