Accession Number : AD0724722

Title :   UHF MOS Integrated Circuits.

Descriptive Note : Quarterly rept. no. 11, 1 Oct-31 Dec 70,

Corporate Author : RCA SOLID STATE DIV SOMERVILLE N J

Personal Author(s) : Dawson,Robert H.

Report Date : JUN 1971

Pagination or Media Count : 16

Abstract : Two ceramic carriers were designed and batch fabricated to accommodate beam-leaded UHF MOS transistors. One approach requires a receptacle hole to be formed in the ceramic piece. This approach is attractive because it is ideally adaptable for use in UHF integrated circuits. The other approach is a thick-plate, planar approach that is amenable to large batch fabrication techniques. It too is adaptable for use in UHF integrated circuits but electrical grounding requires detailed consideration. Initial results with the planar approach are very encouraging. (Author)

Descriptors :   (*INTEGRATED CIRCUITS, MANUFACTURING), ULTRAHIGH FREQUENCY, TRANSISTORS, CIRCUIT INTERCONNECTIONS, CERAMIC MATERIALS, BONDING, STRIP TRANSMISSION LINES, MICROWAVE EQUIPMENT

Subject Categories : Electrical and Electronic Equipment
      Ceramics, Refractories and Glass

Distribution Statement : APPROVED FOR PUBLIC RELEASE