Accession Number : AD0733304

Title :   A Study of Some Parameters Affecting Film Boiling Deposition,

Corporate Author : ARMY MISSILE COMMAND REDSTONE ARSENAL ALA PHYSICAL SCIENCES DIRECTORATE

Personal Author(s) : Nieberlein,Vernon A.

Report Date : JUL 1971

Pagination or Media Count : 22

Abstract : A continuation of laboratory work on a process for depositing SiC by film boiling is described. The effects of time and fiber diameter on plating rates were determined empirically. Variations in plating cell geometry, intermediate contacts, and pre-plating treatments on the tungsten substrate were investigated. Eleven additives to the plating fluid were tried and their effects on the quality of the deposit were noted. (Author)

Descriptors :   (*FIBERS, DEPOSITION), (*DEPOSITION, *FILM BOILING), (*SILICON CARBIDES, DEPOSITION), TUNGSTEN, WIRE, SUBSTRATES, COATINGS, CYCLOHEXANES, SILANES, COMPUTER PROGRAMS

Subject Categories : Textiles

Distribution Statement : APPROVED FOR PUBLIC RELEASE